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Basics

Details

Alternate

MC9S08QE8CTG

NXP Semiconductors

  • PDF:
  • Packaging: TSSOP
  • ROHS:
  • Status: Active
  • Series: -
  • Speed: 20 MHz
  • Width: 4.4 mm
  • Length: 5 mm
  • Has ADC: YES
  • Bit Size: 8
  • HTS Code: 8542.31.00.01
  • ECCN Code: 3A991.A.2
  • Rohs Code: Yes
  • Popularity: 677
  • Technology: CMOS
  • RAM (bytes): 512
  • ROM (words): 8192
  • Subcategory: Microcontrollers
  • DAC Channels: NO
  • DMA Channels: NO
  • JESD-30 Code: R-PDSO-G16
  • PWM Channels: YES
  • Package Code: TSSOP
  • JESD-609 Code: e3
  • Package Shape: RECTANGULAR
  • Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
  • Surface Mount: YES
  • Terminal Form: GULL WING
  • Power Supplies: 1.8/3.6 V
  • Terminal Pitch: 0.65 mm
  • Terminal Finish: TIN
  • Address Bus Width: 0
  • Factory Lead Time: 4 weeks
  • Seated Height-Max: 1.2 mm
  • Temperature Grade: INDUSTRIAL
  • Terminal Position: DUAL
  • Source Content uid: MC9S08QE8CTG
  • Supply Voltage-Max: 3.6 V
  • Supply Voltage-Min: 1.8 V
  • Supply Voltage-Nom: 3 V
  • Clock Frequency-Max: 16 MHz
  • Number of I/O Lines: 14
  • Number of Terminals: 16
  • Package Description: TSSOP, TSSOP16,.25
  • ROM Programmability: FLASH
  • Part Life Cycle Code: Active
  • Qualification Status: Not Qualified
  • Package Body Material: PLASTIC/EPOXY
  • Reach Compliance Code: compliant
  • External Data Bus Width: 0
  • Package Equivalence Code: TSSOP16,.25
  • Operating Temperature-Max: 85°C
  • Operating Temperature-Min: -40°C
  • Moisture Sensitivity Level: 3
  • uPs/uCs/Peripheral ICs Type: MICROCONTROLLER
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 40

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