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Basics

Details

AGL600V2-FGG256YI

Microchip Technology Inc

  • PDF: -
  • Packaging: BGA
  • ROHS:
  • Status: Active
  • Series: -
  • Width: 17 mm
  • Length: 17 mm
  • HTS Code: 8542.39.00.01
  • Rohs Code: Yes
  • Popularity: 0
  • Technology: CMOS
  • JESD-30 Code: S-PBGA-B256
  • Organization: 600000 GATES
  • Package Code: BGA
  • JESD-609 Code: e1
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Surface Mount: YES
  • Terminal Form: BALL
  • Terminal Pitch: 1 mm
  • Terminal Finish: TIN SILVER COPPER
  • Number of Inputs: 177
  • Number of Outputs: 177
  • Seated Height-Max: 1.8 mm
  • Terminal Position: BOTTOM
  • Supply Voltage-Max: 1.575 V
  • Supply Voltage-Min: 1.14 V
  • Supply Voltage-Nom: 1.2 V
  • Number of Terminals: 256
  • Part Life Cycle Code: Active
  • Number of Logic Cells: 13824
  • Package Body Material: PLASTIC/EPOXY
  • Reach Compliance Code: compliant
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code: BGA256,16X16,40
  • Operating Temperature-Max: 100°C
  • Operating Temperature-Min: -40°C
  • Moisture Sensitivity Level: 3
  • Number of Equivalent Gates: 600000
  • Peak Reflow Temperature (Cel): 250
  • Time@Peak Reflow Temperature-Max (s): 30

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